AEMC expands R&D on semiconductor adhesives

AEMC has announced a joint venture to build a research and development center specializing in semiconductor adhesives. The facility will be located within the Southern Taiwan Science Park.

The initiative underscores AEMC's commitment to advanced materials for the electronics industry. The new center will focus on developing high-performance adhesives, crucial for semiconductor assembly and reliability.

This strategic investment aims to improve AEMC's deliveries and consolidate its presence in the global semiconductor market, a rapidly expanding sector.