C Sun has announced an investment of NT$1.48 billion (New Taiwan Dollars, approximately €46 million) in its plant located in Taichung. The primary goal of this investment is to enhance the production capacity of cutting-edge equipment for chip packaging, specifically designed for artificial intelligence applications.

This strategic investment responds to the growing demand for advanced solutions in the field of AI, where chip packaging plays a crucial role in determining the performance and efficiency of systems. The expansion of the Taichung plant will allow C Sun to meet the needs of its customers in a rapidly evolving market.

For those evaluating on-premise deployments, there are trade-offs to consider carefully. AI-RADAR offers analytical frameworks on /llm-onpremise to evaluate these aspects.