## Advanced Packaging: A Challenge for AI AI chip design for artificial intelligence (AI) and High Performance Computing (HPC) applications is reaching the limits of current advanced packaging technologies. The trend is to shift the focus from the single transistor to the package itself, given the increasing complexity and size of the chips. 2.5D packaging techniques, while representing a step forward compared to traditional solutions, are showing their limits with the new AI chips, which are increasingly demanding in terms of interconnection density and thermal management. Alternative solutions are being studied, but their large-scale implementation will still require years of research and development. ## The Role of Packaging in Chip Evolution Chip packaging has become a crucial element in the evolution of hardware, especially for applications that require high performance and low power consumption. Advanced packaging techniques allow multiple chips to be integrated into a single package, reducing interconnection distances and improving overall system efficiency. This is particularly important for chips dedicated to AI, where computing speed and the ability to process large amounts of data are critical.