Rohm bets on TSMC's GaN for AI

Rohm has announced the integration of TSMC's GaN (gallium nitride) process to scale up the production of components for AI servers. The goal is to meet the growing market demand, with a timeline set for 2027.

The adoption of GaN, a wide-bandgap semiconductor, will enable the development of more energy-efficient solutions compared to traditional silicio components. This is particularly relevant in the context of AI servers, where the required computing power is constantly increasing and energy efficiency is a critical factor.

This strategic partnership between Rohm and TSMC aims to position Rohm as a key supplier for the AI server sector, leveraging TSMC's advanced manufacturing capabilities and Rohm's experience in the development of power components.