OpenAI’s Jalapeño, Qualcomm Dragonfly, and expanding packaging capacity mark an industry-wide push for custom inference chips, while NAND and HBM memory shortages and TSMC price hikes underscore persistent bottlenecks.
JCET’s $1.1 billion expansion in advanced packaging shows China's strategy to bypass semiconductor restrictions and secure AI accelerator supply. It signals that for the on-premise market, the real battle is shifting to chiplet integration and high-b...
Nvidia is betting on co-packaged optics as a lever for the next generation of AI infrastructure. At the heart of the roadmap is TSMC’s COUPE platform, integrating photonics and silicon for more efficient interconnects. For organizations managing on-p...
Micron Technology says the memory shortage for AI workloads will persist past 2027, and it has already secured customer deals worth $100 billion. The crunch, especially for HBM memory, is reshaping data center expansion plans and on-premise infrastru...
At its 2026 Investor Day, Qualcomm unveiled the Dragonfly C1000 CPU, a proprietary high-bandwidth memory alternative to HBM, and new AI accelerators. The push into data center racks signals a shift that could reshape the landscape for those seeking h...
Broadcom and OpenAI have unveiled Jalapeño, OpenAI's first custom processor. It's a massive reticle-sized ASIC optimized exclusively for inference, built in an ultra-fast nine-month cycle. The move underscores the race toward proprietary silicon for ...
TSMC has reportedly raised prices for all advanced nodes, which account for 74% of its wafer business. Nvidia, AMD, Apple, and Qualcomm will face higher wafer costs, likely impacting the pricing of GPUs and AI accelerators. For on-premise AI deployme...
The Dutch startup closed the largest deep-tech round in the Netherlands, reaching a $1.6B valuation and attracting sovereign wealth funds. Its atomic-scale inspection technology becomes strategic for the quality of advanced chips — the same ones that...
The expansion of AI data centers intensifies demand for high-speed optical interconnects. However, the production of 6-inch indium phosphide (InP) wafers, a key material for optical modules, struggles to keep pace, creating a bottleneck that threaten...
