The AI boom is fueling record investments in semiconductor manufacturing, packaging, cooling, and memory. From Intel’s 18A-P process to SK Hynix’s HBM4E and next-gen cooling solutions, the supply chain is racing to meet the explosive demand for AI-dedicated hardware.
SK Hynix has announced the commencement of shipping its first HBM4E samples, the company's next-generation high-bandwidth memory, to major AI industry customers. This technology features a 12-layer stack, achieving a capacity of 48GB, and operates at...
The global expansion of AI-dedicated data centers is generating unprecedented demand for Taiwanese manufacturers of passive components. This phenomenon highlights the growing need for robust infrastructure to support AI workloads, with significant im...
Ajinomoto's insulating film, a critical component for advanced chip packaging, is facing significant pressure on its supply chain. The escalating demand for artificial intelligence is testing production capacity, with potential repercussions on the a...
Gem Terminal, a company specializing in thermal materials, anticipates a significant growth curve in 2026, driven by shipments of solutions for artificial intelligence. This trend underscores the increasing importance of thermal management for high-p...
Intel has announced that its 18A-P process, an evolution of the 18A node, has entered 'risk production'. This technology promises a 9% performance improvement at iso-power and a 40% reduction in thermal resistance. As a drop-in upgrade, it aims to en...
Semiconductor equipment sales have hit a record US$36.55 billion, driven by the surging demand for AI chips. This boom highlights supply chain pressures and challenges for companies planning on-premise Large Language Model (LLM) deployments, where ha...
