AMD and Samsung: a strategic partnership for AI

AMD and Samsung are expanding their collaboration in the field of artificial intelligence (AI) chips. The agreement involves Samsung supplying HBM4 (High Bandwidth Memory) to AMD, as well as initiating discussions on foundry production.

AMD CEO Lisa Su and Samsung chairman Lee Jae-yong discussed potential synergies between the two companies. The supply of HBM4 is particularly significant, as this memory is critical to the performance of next-generation AI chips, offering high bandwidth and reducing processing bottlenecks.

The collaboration could extend to the production of AMD chips by Samsung, leveraging the latter's advanced foundry capabilities. This is particularly relevant in a context of increasing demand for AI chips and diversification of supply chains.

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