Greatek reaches full production capacity

Greatek, a manufacturer specializing in advanced packaging solutions, has announced that it has reached full production capacity for its flip chip and QFN (Quad Flat No-leads) services. The strong demand is mainly driven by the artificial intelligence sector, which requires increasingly sophisticated packaging solutions to manage growing computing needs.

The company plans to continue investing in expanding its production capacity to meet ever-increasing demand. Advanced packaging has become a crucial element in the development of high-performance chips, particularly for artificial intelligence applications, where density and energy efficiency are critical factors.

For those evaluating on-premise deployment of AI solutions, it is important to consider that the availability of components with advanced packaging can influence the choice of suppliers and delivery times. AI-RADAR offers analytical frameworks on /llm-onpremise to evaluate these trade-offs.