AblePrint Sees Boom Thanks to AI Chip Packaging

AblePrint, a TSMC supplier specializing in semiconductor packaging services, anticipates significant revenue growth. According to DIGITIMES, the company estimates a 142% increase in January 2026, driven by strong demand for advanced packaging solutions for chips destined for artificial intelligence applications.

This increase reflects the growing importance of packaging in the semiconductor industry. Advanced packaging has become a crucial element in improving the performance and efficiency of chips, especially in high-performance applications such as AI.

The ability to provide cutting-edge packaging services has become a key factor for success in the semiconductor market, and companies like AblePrint, which support TSMC, are in a advantageous position to capitalize on this trend.