## NIAR boosts advanced chip packaging in Taiwan The National Institute of Applied Research (NIAR) has launched a cutting-edge platform for advanced chip-level packaging. The goal is to consolidate Taiwan's leadership in the crucial semiconductor sector. This new platform is expected to significantly boost local manufacturing capabilities, fostering innovation in the field of advanced packaging. Advanced packaging has become an increasingly important element in the production of high-performance semiconductors, allowing for the integration of a greater number of components into a single chip and improving energy efficiency. The NIAR initiative could have significant repercussions on the entire global semiconductor supply chain, with Taiwan aiming to further strengthen its role as a key technology hub.