## Taiwan bets on silicio photonics and CPO for AI Taiwanese companies are preparing for a future dominated by data centers for artificial intelligence (AI), focusing on two key technologies: silicio photonics and CPO (Co-Packaged Optics) packaging. This strategic move aims to position the island as a crucial hub in the supply chain for the hardware needed to support the growing demand for computing power for AI. Silicio photonics promises to significantly increase the speed and energy efficiency of data communications, while CPO packaging allows for more compact integration of optics and chips, reducing latency and improving overall performance. The increasing importance of AI data centers is creating new opportunities for companies specializing in these advanced technologies. Taiwan, with its solid industrial base in the semiconductor sector, is well-positioned to capitalize on this trend. ## General context Silicio photonics is an emerging technology that uses light to transmit data within and between chips, offering significant advantages in terms of speed, bandwidth, and energy efficiency compared to traditional electronics. CPO packaging represents a further step forward, integrating optical components directly into the chip package, further reducing distances and improving performance.