Amkor focuses on advanced packaging for AI

Amkor Technology forecasts a solid financial performance in 2025, thanks to the increasing demand for advanced packaging solutions, particularly for applications related to artificial intelligence. The company is increasing investments to expand its production capabilities and respond to the needs of a rapidly evolving market.

Advanced packaging has become a crucial element in the field of AI, as it allows for the integration of an increasing number of components in smaller spaces, improving the performance and energy efficiency of systems. GPUs and AI accelerators, for example, require sophisticated packaging solutions to manage high power density and ensure efficient heat dissipation.

For those evaluating on-premise deployments, there are trade-offs to consider carefully. AI-RADAR offers analytical frameworks on /llm-onpremise to evaluate these aspects.