Amkor invests in advanced packaging for AI and HPC

Amkor is shifting its strategic focus towards the Artificial Intelligence (AI) and High-Performance Computing (HPC) sectors, with the intention of significantly expanding its advanced packaging capabilities. This decision is a direct response to the increasing demand for increasingly sophisticated packaging solutions, necessary to support the complex processing needs of modern AI and HPC workloads.

Advanced packaging has become a crucial element in enabling superior performance and greater energy efficiency in chips used in AI and HPC applications. Innovative packaging techniques allow for the integration of a greater number of components in a smaller space, reducing latency and improving memory bandwidth. This is particularly important for GPUs and AI accelerators, where the speed and efficiency of data transfer are critical.

For those evaluating on-premise deployments, there are trade-offs to consider. AI-RADAR offers analytical frameworks on /llm-onpremise to evaluate these aspects.