ASML, known for its monopoly in extreme ultraviolet (EUV) lithography, is seeking new growth areas in the advanced packaging sector for artificial intelligence.

The company, which dominates the market for high-end chip manufacturing machines, aims to expand its business beyond EUV lithography, leveraging the growing demand for high-performance packaging solutions needed for AI chips. Advanced packaging has become a crucial element in improving the performance and efficiency of AI processors, allowing for the integration of a larger number of components in a smaller space.

This strategic move will allow ASML to diversify its revenue streams and consolidate its position in the semiconductor market, responding to the new needs of the AI sector.