FIT's 102.4T CPO External Laser Solution

FIT has unveiled a new 102.4T CPO (Co-Packaged Optics) external laser solution specifically designed for data centers supporting artificial intelligence applications. The presentation took place during OFC 2026.

CPO technology is considered a fundamental step forward in addressing the growing bandwidth and energy efficiency needs of modern data centers, especially those dedicated to the inference and training of artificial intelligence models. Integrating optics directly into the chip package reduces signal transmission distances, minimizing losses and improving overall performance.

This FIT solution aims to provide high-speed, low-latency connectivity, essential for AI applications that require intense data processing and rapid communication between system components. The adoption of CPO technologies can help reduce the TCO (Total Cost of Ownership) of data centers by reducing energy consumption and simplifying the network architecture.