Powertech, led by Chairman DK Tsai, has announced an investment of NT$43.3 billion (New Taiwan Dollars) to enhance FOPLP (Fan-Out Panel Level Packaging) technology. The stated goal is to start mass production in the first half of 2027.

This strategic investment underscores Powertech's commitment to the advanced packaging sector, which is crucial for the performance and miniaturization of semiconductors. FOPLP technology offers advantages in terms of interconnection density, heat dissipation, and package size reduction, meeting the growing needs of sectors such as artificial intelligence, 5G, and automotive.

For those evaluating the implementation of advanced on-premise packaging solutions, there are trade-offs to consider carefully. AI-RADAR offers analytical frameworks on /llm-onpremise to evaluate these aspects.