ASE accelerates AI packaging with a new production site

Advanced Semiconductor Engineering (ASE) has announced the start of construction for a new facility in Southern Taiwan, focused on developing advanced packaging solutions for artificial intelligence applications. The new facility is expected to be operational in the second quarter of 2028.

This strategic investment responds to the growing demand for high-performance packaging, which is essential to support the increasingly complex computational capabilities required by AI workloads. Advanced packaging plays a crucial role in improving chip efficiency, density, and reliability, which are fundamental to the performance of AI systems.

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