## Asus Optimizes Cooling on ROG Matrix RTX 5090 Asus has made significant changes to the application of liquid metal Thermal Interface Material (TIM) on its ROG Matrix RTX 5090 graphics cards, intended for the retail market. This revision aims to prevent potential liquid metal leaks, a problem encountered in early samples. Overclocker der8auer highlighted that the versions intended for customers feature a "much more professional" application of the liquid metal. Previously, the samples showed an uneven distribution and an imperfect ring around the GPU core, increasing the risk of leaks. Now, the liquid metal is applied with greater precision, with well-defined lines closer to the IHS (Integrated Heat Spreader), improving cooling effectiveness and safety. The use of liquid metal as a thermal interface is a common practice in high-end graphics cards to maximize heat transfer from the chip to the cooling system. However, its application requires extreme care to avoid short circuits or damage to surrounding components. Asus's revision demonstrates a commitment to the quality and reliability of its flagship products.