Texas Instruments and NXP Semiconductors have announced strong financial results, particularly benefiting from the high demand for power management solutions within data centers dedicated to artificial intelligence.

Growth of advanced packaging

The increasing performance requirements of GPUs and AI accelerators have led to greater complexity in power systems. This, in turn, has generated a significant boost for the advanced semiconductor packaging sector, which is essential to ensure signal integrity and thermal efficiency of components.

Market context

Competition in the AI semiconductor market is increasingly intense, with a growing number of companies developing specialized solutions for machine learning model training and inference. The need to efficiently manage power in these complex systems is a crucial challenge, and companies like Texas Instruments and NXP are well-positioned to capitalize on this trend.